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Reflow oven Product List and Ranking from 17 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Reflow oven Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 千住金属工業 Tokyo//Electronic Components and Semiconductors
  2. シンアペックス Nagano//Industrial Electrical Equipment
  3. 弘輝テック Saitama//Industrial Machinery
  4. 4 タイセー 本社 Chiba//Industrial Machinery
  5. 5 オリジン Saitama//equipment
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Reflow oven Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. N2 Reflow Furnace "SNR-GT II Series" 千住金属工業
  2. Senju Metal Industry Reflow Oven SNR-850MB 千住金属工業
  3. Far Infrared Combined Hot Air Circulation Reflow Oven "VFR Series" 弘輝テック
  4. Tabletop Conveyor Reflow Oven SVO-340C シンアペックス
  5. 5 Air flow furnace エイテックテクトロン

Reflow oven Product List

1～15 item / All 42 items

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Technical Data: Void Reduction Effect by Vacuum "Pressurized" Reflow

Technical Data: Void Reduction Effect by Vacuum "Pressurized" Reflow

Attention quality control and production management departments! We will introduce the verification results of vacuum pressure reflow, which is effective in reducing voids.

This document discusses the void reduction effects of vacuum pressure reflow. Using a vacuum reflow furnace, a method of reducing voids in solder joints through defoaming and compression is commonly utilized. However, to verify even more effective methods, we conducted reflow soldering using three different conditions and various test samples, and we present the results in detail with images. Please feel free to download and take a look. 【Contents】 ■ Importance of low-void soldering ■ Verification of effective processes for void reduction ■ Test samples ■ Test results ■ Summary of results *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Tabletop Reflow Oven (Heating Furnace) SVO-1 Plus

Tabletop Reflow Oven (Heating Furnace) SVO-1 Plus

Top and bottom heating, supports heating up to 400℃, tabletop reflow furnace (heating furnace).

The SVO-1 Plus is a tabletop reflow oven newly added to the lineup as a higher model of the SVO-1, aimed at further improving heating speed and temperature uniformity. Heaters are arranged above and below the oven, and the output of each heater can be individually set. By optimizing the heating temperature settings and heater output suitable for the target workpieces, it is possible to shorten cycle times and improve the uniformity of workpiece temperatures. In addition to its use for reflow soldering, it can also operate for long periods at a constant temperature, making it suitable for applications such as board drying and thermal curing. 【Features】 ■ Supports heating from above and below the board ■ Individual setting of each heater output ■ Supports heating up to 400°C ■ Temperature profile settings for up to 8 zones ■ Continuous operation at a constant temperature for up to 10 hours *For more details, please download the PDF or contact us.

  • Reflow Equipment

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Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Heating settings up to 450℃, compatible with formic acid reduction processes, standard equipped with substrate cooling function.

This is a tabletop vacuum reflow oven that significantly reduces voids inside solder by changing the pressure within the process chamber, enabling high-quality voidless soldering. The heating area measures 200mm x 200mm x height 50mm and supports heating from both above and below. The pressure can be set arbitrarily within the range of atmospheric pressure to 10Pa, allowing for flexible adjustment of pressure and heating profiles according to the target workpiece. By using an optional formic acid bubbler unit with a heat retention function, it generates a stable concentration of a mixed gas of formic acid and nitrogen, removing the oxide film from the workpiece through a reduction reaction, and it can also accommodate a fluxless soldering process that does not use flux.

  • Soldering Equipment
  • Reflow Equipment

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Tabletop reflow oven

Tabletop reflow oven

Introducing compactly designed products that are perfect for reflow small furnaces!

We would like to introduce our "desktop reflow oven." It features five infrared heaters on both the top and bottom. Each heater can be individually controlled for temperature, making it suitable for reflowing small circuit boards. Additionally, we also offer an N2 specification separately. Please feel free to contact us if you are interested. 【Features】 ■ Suitable for small-batch production of various types ■ Compact design ■ High-precision temperature distribution *For other functions and details, please contact us.

  • Drying Equipment

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【Delivery Example】Desktop Reflow Oven

【Delivery Example】Desktop Reflow Oven

The furnace length is short and the temperature can be adjusted up and down, making it suitable for data collection before mass production!

The "desktop reflow oven" is used for substrate preheating and soldering processes. Recently, it has increasingly been used for destructive testing applications. The temperature curve maintains 160°C to 180°C (first stage) and 240°C to 260°C (end of irradiation). Depending on the shape of the substrate, a combination with hot air can also be proposed. Additionally, due to its short furnace length and adjustable upper and lower temperatures, it is suitable for data collection before mass production, and it is a popular model known for its high-precision temperature distribution and compact design. [Recommended Machine] ■ Product Name: Desktop Reflow Oven ■ Model: USTR-1210-NET III ■ Heat Source Used: Ultra Thermo III A, 5 sheets each for upper and lower *For more details, please refer to the related links or feel free to contact us.

  • 卓上リフロー炉2.png
  • Reflow Equipment

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Senju Metal Industry Reflow Oven SNR-850MB

Senju Metal Industry Reflow Oven SNR-850MB

Microball dedicated gentle breeze circulation N2 reflow oven

This is a reflow furnace for microball mounting equipped with features that are well-received in the SNR series.

  • Other semiconductor manufacturing equipment

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N2 Reflow Furnace "SNR-GT II Series"

N2 Reflow Furnace "SNR-GT II Series"

Maintenance can be performed in a short time! This is a reflow oven that also takes environmental harmony into consideration.

The "SNR-GT II Series" is a reflow oven equipped with a new flux recovery unit and cooling function that contributes to reducing downtime. We have newly developed a flux recovery system unique to our company, well-versed in the characteristics of solder paste. By selecting and combining multiple units, it maintains recovery efficiency over a long period and enables extended maintenance cycles. 【Features】 ■ Further improvement in productivity ■ Consideration for environmental harmony ■ High functionality made easy to use *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300

300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.

This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*

  • Soldering Equipment
  • Reflow Equipment

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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RVS-210

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RVS-210

A model that is easy to maintain even with a high occurrence of contamination due to flux and other factors. Manufactured by Unitec Japan.

The RVS-210 is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for solving challenges related to no-clean and lead-free processes. In addition to "hydrogen reduction" for removing the oxide layer on the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid improves wettability even without flux. Despite its compact design, which is among the smallest in the industry, it condenses all the necessary functions and performance for various prototype developments into one unit. With a wide range of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Supports a maximum temperature of 400°C - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile with high repeatability and minimal overshoot - The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to contact us.*

  • Soldering Equipment
  • Reflow Equipment

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-3×210-S

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-3×210-S

The largest heating plate size in the series, 630mm x 200mm, suitable for large objects and simultaneous creation! Made by Unitec Japan.

The "RSS-3×210-S" is a desktop vacuum solder reflow device that enables a maximum void-free rate of 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The strong reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required in power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Near-zero in-plane temperature difference on the heating plate, allowing for uniform heating of large objects - Nearly exact realization of the set temperature profile, with high repeatability and almost zero overshoot - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen *We also accept requests for free demonstrations. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to reach out to us.*

  • Soldering Equipment
  • Reflow Equipment

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S

Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-160-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. In addition to conventional "flux" and "hydrogen reduction," it also supports reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. Despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to support a wide range of prototype development. 【Features】 ■ Rapid heating at 100°C per minute, and with water cooling, significantly reduces takt time ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S

Standard model that achieves high-reliability implementation such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-110-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 2°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly exact realization of the set temperature profile High repeatability with almost zero overshoot ■ Minimal in-plane temperature difference on the heating plate, allowing uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment

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Solder Reflow Device 'RSS-3X210-S'

Solder Reflow Device 'RSS-3X210-S'

Multi-functional with a touch panel! One unit can handle various reflows such as air, nitrogen, vacuum, formic acid, and hydrogen!

The "RSS-3X210-S" is a solder reflow device that supports both formic gas and hydrogen gas reduction, with enhanced safety features. It can process up to 12 wafers with a diameter of 100mm at once, and is also suitable for reflowing elongated objects such as printer heads and LED lighting. Equipped with 18 high-speed infrared (IR) heaters under the hot plate, it maintains a uniform temperature even in a wide effective heating area, achieving stable heating that is less affected by the heat capacity of the objects. 【Features】 ■ Effective heating area: 630mm x 210mm ■ Equipped with high-speed infrared (IR) heaters ■ Standard 7-inch touch panel ■ Active water cooling system ■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Batch-type simple reflow furnace

Batch-type simple reflow furnace

Achieves performance equivalent to that of large conveyor-type reflow ovens while being a space-saving tabletop type.

Features - Flexible profile creation. - Rapid heating due to a unique heating method. Compatible with high-temperature solder. - Significant reduction in preparation and cooldown times. Energy-saving design that does not use excess power. - Preheat zone established, greatly reducing production cycle time. - Through-batch method replicates the performance of large conveyor types.

  • Reflow Equipment

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Tabletop Solder Reflow Oven TRF-95

Tabletop Solder Reflow Oven TRF-95

The world's smallest class reflow oven (TRF-95) is finally on sale! ~ A compact reflow oven for easy and convenient use in labs or at home ~

Compared to conventional commercial products, we have achieved significant miniaturization, weight reduction, and low cost! Anyone can easily reflow cream solder on a wiring board anywhere and in a short time. The original product introduced by Taisei Co., Ltd., the tabletop reflow furnace, features: - A compact size that is less than half that of conventional products! - The ability to observe solder melting through glass! - Suppression of flux and solder splatter outside the furnace! We also accept custom sizes to fit your hot plate. Please feel free to contact us.

  • Reflow Equipment

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