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Reflow oven Product List and Ranking from 17 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

Reflow oven Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. 日精 本社 Tokyo//Machine elements and parts
  2. オリジン Saitama//equipment
  3. 千住金属工業 Tokyo//Electronic Components and Semiconductors
  4. 4 タイセー 本社 Chiba//Industrial Machinery
  5. 5 シンアペックス Nagano//Industrial Electrical Equipment
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Reflow oven Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. N2 Reflow Furnace "SNR-GT II Series" 千住金属工業
  2. Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S 日精 本社
  3. Formic Acid Reduction Vacuum Reflow Furnace / Multi-Module Type 'MPX Series' オリジン
  4. Formic acid reduction vacuum reflow furnace オリジン
  5. 4 Vacuum Solder Reflow Oven HVR Series 伯東 本社

Reflow oven Product List

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Technical Data: Void Reduction Effect by Vacuum "Pressurized" Reflow

Technical Data: Void Reduction Effect by Vacuum "Pressurized" Reflow

Attention quality control and production management departments! We will introduce the verification results of vacuum pressure reflow, which is effective in reducing voids.

This document discusses the void reduction effects of vacuum pressure reflow. Using a vacuum reflow furnace, a method of reducing voids in solder joints through defoaming and compression is commonly utilized. However, to verify even more effective methods, we conducted reflow soldering using three different conditions and various test samples, and we present the results in detail with images. Please feel free to download and take a look. 【Contents】 ■ Importance of low-void soldering ■ Verification of effective processes for void reduction ■ Test samples ■ Test results ■ Summary of results *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment
  • Reflow oven

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Tabletop Reflow Oven (Heating Furnace) SVO-1 Plus

Tabletop Reflow Oven (Heating Furnace) SVO-1 Plus

Top and bottom heating, supports heating up to 400℃, tabletop reflow furnace (heating furnace).

The SVO-1 Plus is a tabletop reflow oven newly added to the lineup as a higher model of the SVO-1, aimed at further improving heating speed and temperature uniformity. Heaters are arranged above and below the oven, and the output of each heater can be individually set. By optimizing the heating temperature settings and heater output suitable for the target workpieces, it is possible to shorten cycle times and improve the uniformity of workpiece temperatures. In addition to its use for reflow soldering, it can also operate for long periods at a constant temperature, making it suitable for applications such as board drying and thermal curing. 【Features】 ■ Supports heating from above and below the board ■ Individual setting of each heater output ■ Supports heating up to 400°C ■ Temperature profile settings for up to 8 zones ■ Continuous operation at a constant temperature for up to 10 hours *For more details, please download the PDF or contact us.

  • Reflow Equipment
  • Reflow oven

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Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Heating settings up to 450℃, compatible with formic acid reduction processes, standard equipped with substrate cooling function.

This is a tabletop vacuum reflow oven that significantly reduces voids inside solder by changing the pressure within the process chamber, enabling high-quality voidless soldering. The heating area measures 200mm x 200mm x height 50mm and supports heating from both above and below. The pressure can be set arbitrarily within the range of atmospheric pressure to 10Pa, allowing for flexible adjustment of pressure and heating profiles according to the target workpiece. By using an optional formic acid bubbler unit with a heat retention function, it generates a stable concentration of a mixed gas of formic acid and nitrogen, removing the oxide film from the workpiece through a reduction reaction, and it can also accommodate a fluxless soldering process that does not use flux.

  • Soldering Equipment
  • Reflow Equipment
  • Reflow oven

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Tabletop reflow oven

Tabletop reflow oven

Introducing compactly designed products that are perfect for reflow small furnaces!

We would like to introduce our "desktop reflow oven." It features five infrared heaters on both the top and bottom. Each heater can be individually controlled for temperature, making it suitable for reflowing small circuit boards. Additionally, we also offer an N2 specification separately. Please feel free to contact us if you are interested. 【Features】 ■ Suitable for small-batch production of various types ■ Compact design ■ High-precision temperature distribution *For other functions and details, please contact us.

  • Drying Equipment
  • Reflow oven

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【Delivery Example】Desktop Reflow Oven

【Delivery Example】Desktop Reflow Oven

The furnace length is short and the temperature can be adjusted up and down, making it suitable for data collection before mass production!

The "desktop reflow oven" is used for substrate preheating and soldering processes. Recently, it has increasingly been used for destructive testing applications. The temperature curve maintains 160°C to 180°C (first stage) and 240°C to 260°C (end of irradiation). Depending on the shape of the substrate, a combination with hot air can also be proposed. Additionally, due to its short furnace length and adjustable upper and lower temperatures, it is suitable for data collection before mass production, and it is a popular model known for its high-precision temperature distribution and compact design. [Recommended Machine] ■ Product Name: Desktop Reflow Oven ■ Model: USTR-1210-NET III ■ Heat Source Used: Ultra Thermo III A, 5 sheets each for upper and lower *For more details, please refer to the related links or feel free to contact us.

  • 卓上リフロー炉2.png
  • Reflow Equipment
  • Reflow oven

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Senju Metal Industry Reflow Oven SNR-850MB

Senju Metal Industry Reflow Oven SNR-850MB

Microball dedicated gentle breeze circulation N2 reflow oven

This is a reflow furnace for microball mounting equipped with features that are well-received in the SNR series.

  • Other semiconductor manufacturing equipment
  • Reflow oven

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N2 Reflow Furnace "SNR-GT II Series"

N2 Reflow Furnace "SNR-GT II Series"

Maintenance can be performed in a short time! This is a reflow oven that also takes environmental harmony into consideration.

The "SNR-GT II Series" is a reflow oven equipped with a new flux recovery unit and cooling function that contributes to reducing downtime. We have newly developed a flux recovery system unique to our company, well-versed in the characteristics of solder paste. By selecting and combining multiple units, it maintains recovery efficiency over a long period and enables extended maintenance cycles. 【Features】 ■ Further improvement in productivity ■ Consideration for environmental harmony ■ High functionality made easy to use *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment
  • Reflow oven

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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300

300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.

This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*

  • Soldering Equipment
  • Reflow Equipment
  • Reflow oven

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S

Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-160-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. In addition to conventional "flux" and "hydrogen reduction," it also supports reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. Despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to support a wide range of prototype development. 【Features】 ■ Rapid heating at 100°C per minute, and with water cooling, significantly reduces takt time ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment
  • Reflow oven

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S

Standard model that achieves high-reliability implementation such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-110-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 2°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly exact realization of the set temperature profile High repeatability with almost zero overshoot ■ Minimal in-plane temperature difference on the heating plate, allowing uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment
  • Reflow oven

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Solder Reflow Device 'RSS-3X210-S'

Solder Reflow Device 'RSS-3X210-S'

Multi-functional with a touch panel! One unit can handle various reflows such as air, nitrogen, vacuum, formic acid, and hydrogen!

The "RSS-3X210-S" is a solder reflow device that supports both formic gas and hydrogen gas reduction, with enhanced safety features. It can process up to 12 wafers with a diameter of 100mm at once, and is also suitable for reflowing elongated objects such as printer heads and LED lighting. Equipped with 18 high-speed infrared (IR) heaters under the hot plate, it maintains a uniform temperature even in a wide effective heating area, achieving stable heating that is less affected by the heat capacity of the objects. 【Features】 ■ Effective heating area: 630mm x 210mm ■ Equipped with high-speed infrared (IR) heaters ■ Standard 7-inch touch panel ■ Active water cooling system ■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment
  • Reflow oven

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Batch-type simple reflow furnace

Batch-type simple reflow furnace

Achieves performance equivalent to that of large conveyor-type reflow ovens while being a space-saving tabletop type.

Features - Flexible profile creation. - Rapid heating due to a unique heating method. Compatible with high-temperature solder. - Significant reduction in preparation and cooldown times. Energy-saving design that does not use excess power. - Preheat zone established, greatly reducing production cycle time. - Through-batch method replicates the performance of large conveyor types.

  • Reflow Equipment
  • Reflow oven

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Tabletop Solder Reflow Oven TRF-95

Tabletop Solder Reflow Oven TRF-95

The world's smallest class reflow oven (TRF-95) is finally on sale! ~ A compact reflow oven for easy and convenient use in labs or at home ~

Compared to conventional commercial products, we have achieved significant miniaturization, weight reduction, and low cost! Anyone can easily reflow cream solder on a wiring board anywhere and in a short time. The original product introduced by Taisei Co., Ltd., the tabletop reflow furnace, features: - A compact size that is less than half that of conventional products! - The ability to observe solder melting through glass! - Suppression of flux and solder splatter outside the furnace! We also accept custom sizes to fit your hot plate. Please feel free to contact us.

  • Reflow Equipment
  • Reflow oven

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Ultra-compact vacuum reflow furnace TRF-125V

Ultra-compact vacuum reflow furnace TRF-125V

Finally on sale! ~Ultra-compact vacuum reflow oven~

We are pleased to announce the launch of the vacuum reflow oven (TRF-125V) in our highly acclaimed reflow oven series! ■ Despite its reasonable price, this unit allows for reflow in a vacuum environment or using nitrogen gas! ■ With its ultra-lightweight and compact design, it is one of the smallest in the world, making it easy to install in labs! ■ High temperature control capability with PID control! ■ Many options available, including a manometer, magnifying glass, general-purpose regulator, gas cylinders (N2, CO2), vacuum pump, and more!

  • Reflow Equipment
  • Reflow oven

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Ultra-compact vacuum reflow oven TR-125V2

Ultra-compact vacuum reflow oven TR-125V2

The definitive version of the ultra-compact vacuum reflow oven!!

We are excited to announce the launch of the ultra-compact vacuum reflow oven (TR-125V2) in our highly acclaimed ultra-compact reflow oven series! This ultra-compact vacuum reflow oven is perfect for those who want to introduce a reflow oven but are struggling with high prices or lack of space, as well as for those who already own a reflow oven but find it cumbersome and time-consuming to operate a large reflow oven.

  • Other semiconductors
  • Reflow oven

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Fujino Trading Co., Ltd. Business Introduction

Fujino Trading Co., Ltd. Business Introduction

Total production of equipment made possible by a trading company.

Tsuneno Corporation focuses on the sale of FA-related equipment and has established overseas bases to expand its global presence, enabling it to handle hundreds of thousands of products. Specific products we handle range from soldering-related devices and labor-saving equipment to control system devices and large-scale automatic assembly equipment. 【Features】 ■ High proposal capability ■ Utilization of networks ■ Global expansion ■ Manufacturing consolidated with related/cooperating factories ■ Product strength capable of handling hundreds of thousands of items ■ Joint development with partner companies *For more details, please download the PDF or feel free to contact us.

  • Machinery and equipment installation/dismantling/relocation
  • Calibration and repair
  • Reflow oven

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Point soldering device "ZEVA m type"

Point soldering device "ZEVA m type"

A point soldering device that inherits the achievements of selective nozzles 6745 and 6746!

The "ZEVAｍ type" is a point soldering device that allows soldering with two types of nozzles by adding a solder pot as an option. It is a product that inherits the achievements of the selective nozzles 6745 and 6746. 【Product Dimensions】 ■ Length: 2,370mm ■ Width: 1,285mm ■ Height (without light tower): 1,220mm *For more details, please download the PDF or feel free to contact us.

  • Soldering Equipment
  • Reflow oven

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Vacuum Solder Reflow Oven HVR Series

Vacuum Solder Reflow Oven HVR Series

This is an inline vacuum solder reflow furnace compatible with voidless flux-free technology.

Recently, with the evolution of power semiconductors and advanced packaging, high-quality solder joints are in demand. Therefore, void (bubble) suppression and flux-free solder reflow have become essential. The HVR series can reduce the void rate to less than 1% by evacuating the chamber, allowing voids to escape from the molten solder. Additionally, by using formic acid as a reducing gas, it supports flux-free soldering. A feature of the HVR series is that the solder reflow process (reduction, solder melting, cooling) is continuously processed in a single chamber, and product transport is fully automated by robots. This concept enables inline product input and retrieval, improving productivity by connecting units. We have a demonstration unit available, so if you would like to see the actual machine or request a solder joint demonstration, please feel free to contact us.

  • Soldering Equipment
  • Reflow oven

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Formic Acid Reduction Vacuum Reflow Furnace / Batch Type 'Model: SQ1'

Formic Acid Reduction Vacuum Reflow Furnace / Batch Type 'Model: SQ1'

Equipped with our unique decomposition processing unit! Completely neutralizes formic acid in exhaust.

The "Model: SQ1" is a compact batch-type formic acid reduction vacuum reflow furnace equipped with a heating and cooling mechanism in a single chamber, suitable for research and development as well as small-scale production. The formic acid reduction process eliminates the need for flux and flux cleaning in subsequent processes. Additionally, it allows for the use of a vacuum process effective in reducing voids. Since there is no need to transfer formic acid to a dedicated tank, customers can use the bottles or tanks they have prepared as is. 【Features】 ■ Equipped with our unique gas generator, achieving instantaneous vaporization ■ Incorporates our proprietary heating and cooling mechanism that combines radiation heating with IR heaters and forced water cooling with water-cooled plates ■ Contributes to shortening the reflow process from heating to cooling ■ No need to transfer formic acid to a dedicated tank ■ Equipped with our unique decomposition treatment unit, completely neutralizing formic acid in the exhaust *For more details, please refer to the related links or feel free to contact us.

  • Reflow Equipment
  • Reflow oven

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Formic Acid Reduction Vacuum Reflow Furnace / Multi-Module Type 'MPX Series'

Formic Acid Reduction Vacuum Reflow Furnace / Multi-Module Type 'MPX Series'

No need to transfer formic acid to a dedicated tank! You can use the bottles or tanks prepared by the customer as they are.

The MPX series is a vacuum reflow furnace suitable for mass production, capable of installing multiple independent chamber modules that integrate heating and cooling. Thanks to the formic acid reduction process, there is no need for flux or flux cleaning in subsequent processes. Additionally, it is possible to utilize a vacuum process that is effective in reducing voids. It features our unique heating and cooling mechanism that combines radiation heating from IR heaters with forced water cooling from water-cooled plates. 【Features】 - Equipped with our proprietary gas generator, achieving instantaneous vaporization. - Incorporates our unique heating and cooling mechanism that combines radiation heating from IR heaters with forced water cooling from water-cooled plates. - Contributes to the reduction of the reflow process from heating to cooling. - No need to transfer formic acid to a dedicated tank. - Equipped with our unique decomposition processing unit, completely neutralizing formic acid in the exhaust. *For more details, please refer to the related links or feel free to contact us.

  • Reflow Equipment
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Tabletop Conveyor Reflow Oven SVO-340C

Tabletop Conveyor Reflow Oven SVO-340C

Compact tabletop conveyor reflow oven compatible with heating up to 400℃.

This is a space-saving tabletop reflow oven (heating furnace) using infrared heaters. It can be used not only for reflow soldering but also for low-speed operation at a constant temperature, making it suitable for applications such as drying circuit boards and thermosetting bonding agents.

  • Heating device
  • Reflow oven

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Tabletop reflow oven (heating furnace) SVO-1

Tabletop reflow oven (heating furnace) SVO-1

Tabletop reflow furnace (heating furnace) compatible with heating up to 400℃.

This is a tabletop heating furnace capable of heating printed circuit boards and flat workpieces up to 250x330mm as standard. The heating temperature profile can be set for up to 8 zones. It can be used not only for reflow soldering but also for long-term operation at a constant temperature, making it suitable for applications such as drying circuit boards, thermal curing of underfill materials, and die bonding pastes.

  • Reflow Equipment
  • Reflow oven

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Vacuum and Pressure Reflow Furnace 'VPF300'

Vacuum and Pressure Reflow Furnace 'VPF300'

With technical data included, significantly reduces void ratio under a maximum pressure of 0.4 MPa. Improves process efficiency with rapid cooling. Compatible with fluxless soldering.

The VPF300 is a vacuum and pressure reflow oven that not only creates a vacuum (reduced pressure) inside the chamber but can also apply pressure up to 0.4 MPa, significantly reducing the void rate inside the solder and achieving high-quality soldering. Process conditions such as chamber pressure and heating temperature can be set for each workpiece, and efficient heating and cooling are possible thanks to its unique rapid cooling function. Additionally, it supports formic acid reduction reflow and forming gas reflow, allowing for the establishment of a flux-free soldering process. The 2023 model has improved the cooling mechanism, enhancing maintainability. 【Features】 ■ A wide effective heating area of 300×300 mm ■ Maximum heating temperature of 450℃ ■ The vacuum chamber is equipped with an observation window ■ Features an intuitive touch panel GUI for easy operation *Product documentation can be viewed via "PDF Download." Please feel free to contact us if you wish to request a test.

  • Reflow Equipment
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  • Reflow oven

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N2 Reflow Device VFR-4010N

N2 Reflow Device VFR-4010N

Achieve easy maintenance with a special filter! You can switch between hot air, warm air, and warm air + far infrared!

The "N2 Reflow Device VFR-4010N" is a unit that combines a unique heating method using a special far-infrared panel heater along with hot air circulation. Depending on the substrate (thickness) and mounted components, it is possible to utilize not only hot air circulation but also the advantages of far-infrared effects for production. This device is designed with consideration for substrates and components. 【Features】 ■ Hot air circulation reflow oven with far-infrared combination ■ Adoption of special far-infrared panel heater ■ Minimizes flux accumulation in the oven, extending maintenance intervals ■ Special filter for mist recovery in the oven (can be reused after cleaning) ■ Energy-saving through reduced heat loss with high-efficiency insulation structure *For more details, please refer to the PDF materials or feel free to contact us.

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  • Reflow Equipment
  • Reflow oven

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Far Infrared Combined Hot Air Circulation Reflow Oven "VFR Series"

Far Infrared Combined Hot Air Circulation Reflow Oven "VFR Series"

Decomposing flux with a special far-infrared panel heater to prevent sticking inside the furnace!

The "VFR Series" is a reflow oven that utilizes a special far-infrared panel heater and hot air circulation system. It minimizes flux adhesion inside the oven, achieving extended maintenance periods. It also allows for mist recovery with a special filter (the filter can be reused after cleaning). Please feel free to contact us when you need assistance. 【Features】 ■ Special far-infrared panel heater and hot air circulation system ■ Minimizes flux adhesion inside the oven, extending maintenance periods ■ Mist recovery with a special filter (the filter can be reused after cleaning) *For more details, please refer to the PDF document or feel free to contact us.

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  • Reflow Equipment
  • Reflow oven

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【Ultra Low Price】Lead-Free Profile Compatible 'Compact Tabletop Reflow Oven'

【Ultra Low Price】Lead-Free Profile Compatible 'Compact Tabletop Reflow Oven'

Responding to the demand to significantly reduce costs for non-production uses such as research and development, experiments, and evaluations! A conveyor-type tabletop reflow oven equipped with the minimum necessary functions.

Achieving ultra-low prices! We have started selling the 'Compact Tabletop Reflow Oven' equipped with essential functions, featuring a 3-zone heating system and a 250mm wide mesh conveyor. 【Features】 ■ Compatible with general lead-free profiles as well as uniform heating profiles ■ Suitable for non-production environments such as research and development, experiments, prototypes, and evaluations ■ Customization options available upon inquiry Feel free to contact us for pricing, delivery times, profile measurements, on-site visits, and demonstrations. * We are also looking for new applications for the heating furnace. * For more details, please refer to the PDF document or contact us directly.

  • Other mounting machines
  • Reflow oven

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Kiyoshi Metal Industry Clean Reflow Furnace CX-430

Kiyoshi Metal Industry Clean Reflow Furnace CX-430

Reflow furnace compatible with semiconductor clean rooms

This is the latest reflow furnace for micro soldering that enables wafer-level solder bump formation and face-down mounting of bare chips.

  • Other semiconductor manufacturing equipment
  • Reflow oven

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Air flow furnace

Air flow furnace

Air flow furnace

Next-generation flow device. Achieving evolving high performance with energy savings and low cost. Developed with a target of reducing carbon dioxide by over 50% to prevent global warming, this is the long-awaited "revolutionary air flow furnace" that completely redefines conventional concepts. 【Features】 Ultra energy-saving system ● A groundbreaking low power consumption performance that is half of the conventional power consumption. ● Achieved a production power setting of 4.5 kW with a nozzle height of 20 mm. Insulation structure that does not affect factory air conditioning ● Adopts polyimide film for the outer case, keeping the cover temperature almost the same as the factory room temperature. Nozzle height adjustment mechanism ● Automatically changes the nozzle height to prevent energy loss. Quick temperature setting changes ● Allows for quick setup changes in a short time. Low running costs + low environmental impact ● Electricity cost reduction: 533,000 yen/unit per year + α (air conditioning costs, etc.) ● CO2 reduction: 8.2 tons/unit per year □ For more details, please contact us.

  • Reflow Equipment
  • Circuit board processing machine
  • Reflow oven

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Tabletop Vacuum Solder Reflow Device 'VSS-450-300'

Tabletop Vacuum Solder Reflow Device 'VSS-450-300'

Implementation without flux is possible through formic acid reduction. There is the advantage of not having to worry about future risks associated with the use of flux.

The main point of this device is that it enables flux-free implementation through formic acid reduction. Since flux is not used at all, there are advantages such as "no need for cleaning processes and their inspection processes" and "no need to worry about flux residues and re-corrosion caused by residues." Additionally, since flux is also a factor for voids, and formic acid weakens the surface tension of solder, it improves the removal of voids and contributes to being void-free. Furthermore, unlike conventional hydrogen reduction, formic acid reduction has a lower starting temperature for the reduction reaction than hydrogen, allowing for the removal of oxide films from substrates and electronic components without causing thermal damage.

  • Reflow Equipment
  • Reflow oven

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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RSO-200

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RSO-200

A super high-speed heating model capable of a maximum heating rate of 600 K/min, suitable for metal sintering. Manufactured by Unitemp Japan.

The "RSO-200" is a desktop vacuum solder reflow device that enables a void-free rate of up to 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. In addition to "hydrogen reduction" for removing oxide films from the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Moreover, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With its diverse reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. 【Features】 ■ Ultra-fast heating rate of 10°C per second, significantly reducing takt time with water cooling ■ Supports maximum temperature of 650°C ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment
  • Reflow oven

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